Experiments,modelling and simulation of adhesive curing processes in bonded three dimensional curved piezo metal composite structures |
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| Authors: | Martin Rudolph Ralf Landgraf Robert Scherzer Jörn Ihlemann |
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| Institution: | Department of Solid Mechanics, Institute of Mechanics and Thermodynamics, Faculty of Mechanical Engineering, Technische Universität Chemnitz, Chemnitz, Germany |
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| Abstract: | This contribution deals with the modelling and simulation of curing phenomena in adhesively bonded piezo metal composites which consists of a piezoelectric module enclosed by an adhesive layer which in turn is surrounded by two metal sheets. A short survey on the neccessary experimental investigations to characterise the adhesive's material behaviour is given and important aspects on the corresponding phenomenological modelling approach are presented. Both steps take into account the curing reaction, changes of volume, like chemical shrinkage, and inelastic mechanical behaviour which is temperature and curing dependent. Finally, the simulation strategy for the modelling within a finite element environment is depicted. By this, residual stresses, secondary deformations and loads on the piezo modules can be predicted, which is exemplified by a comparative study verifying a novel manufacturing strategy. (© 2014 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim) |
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