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不同材料界面Ⅲ型裂纹尖端场实验研究
引用本文:蔺书田,周志刚,薛焕.不同材料界面Ⅲ型裂纹尖端场实验研究[J].力学学报,1992,24(4):504-510.
作者姓名:蔺书田  周志刚  薛焕
作者单位:清华大学工程力学系,清华大学工程力学系,清华大学工程力学系 100084 北京,100084 北京,100084 北京
摘    要:本文应用激光全息干涉法获得了两种材料Ⅲ型界面裂纹试件的离面位移场,通过试验数据处理求得了裂纹尖端附近位移、应力场强度的控制参量K_(Ⅲ),J值,给出了局部解的适用区域。还研究了两种材料粘结界面处的连续条件,分析了结果的合理性。为了对比和分析界面裂纹问题,还对同种材料试件进行了试验和数据处理。

关 键 词:Ⅲ型界面裂纹  全息干涉

EXPERIMENTAL INVESTIGATION OF FIELD OF THE MODE III CRACK TIP BETWEEN DISSIMILAR MATERIAL
Lin Shutian,Zhou Zhigang,Xue Huan.EXPERIMENTAL INVESTIGATION OF FIELD OF THE MODE III CRACK TIP BETWEEN DISSIMILAR MATERIAL[J].chinese journal of theoretical and applied mechanics,1992,24(4):504-510.
Authors:Lin Shutian  Zhou Zhigang  Xue Huan
Abstract:In this paper, the displacement field for the mode III interface crack between two materials is obtained by using the laser holographic interferometry. Through experimental data processing control parameters KIII, J of stress field intensity around crack tip are obtaied, and the applicable region of local solution is given. The continuity condition across the interface between two materials is studied. Rationality of the results is analysed. For contrast, specimen of homogeneous material was testedd and data were processed.
Keywords:mode III interface crack  holographic interferometry  
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