ESPI solution for non-contacting MEMS-on-wafer testing

Rapid progress in the field of micro-electro-mechanical systems (MEMS) makes the development of appropriate measuring and testing means timely. Characterizing the mechanical properties of MEMS structures at a very early stage of manufacturing is a challenging task for quality assurance in this field. The paper describes a new solution that is based upon the vibration analysis of the microparts. The nanometer amplitudes are detected by advanced electronic speckle pattern interferometry (ESPI). A specific signal processing technique has been applied to make the solution robust. Comprehensive numerical simulations provide the theoretical base for the HNDT concept. A laboratory system for 4″ wafer has been built, and extensive tests show that such key properties as e.g. the thickness of springs or membranes can be determined exactly. Automated frequency scanning and corresponding digital image processing open the way to reliable and fast industrial systems for MEMS testing on wafer level.