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The leveling of mask and wafer in proximity nanolithography using fringe pattern phase analysis |
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| Authors: | Feng Xu Shaolin Zhou Song Hu |
| Affiliation: | 1. Faculty of Information and Engineering, Southwest University of Science and Technology, Mianyang, Sichuan 621010, China;2. School of Electronics and Information, South China University of Technology, Guangzhou 510640, China;3. Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China;4. Robot Technology Used for Special Environment Key Laboratory of Sichuan Province, Mianyang, Sichuan, 621010, China |
| Abstract: | The fringe pattern phase analysis method is proposed for the leveling of mask and wafer in proximity lithography. The tilt between mask and wafer in the space is reflected in the tilted fringe pattern. The method combining the 2-D Fourier transform and 2-D Hanning window is proposed for processing the tilted fringe pattern. The offset and angle of tilt are extracted through phase analysis. Computer simulation and experiment are both performed to verify this method. The results indicate that the tilt of the mask and wafer in the space can be extracted with high accuracy through this method. |
| Keywords: | Nanolithography Leveling Fringe pattern analysis Phase extraction |
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