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Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode
Authors:J Maul  J Lin  A Oelsner  D Valdaitsev  N Weber  M Merkel  U Heinzmann  G Schönhense
Institution:a Institut für Physik, Johannes Gutenberg-Universität Mainz, Staudingerweg 7, 55128 Mainz, Germany
b Fakultät für Physik, Universität Bielefeld, Postfach 100131, 33501 Bielefeld, Germany
c Focus GmbH, Neukirchner Str. 2, 65510 Hünstetten-Kesselbach, Germany
d Schott-Lithotec AG, Otto Schott-Str. 13, 07745 Jena, Germany
e Ludwig Maximilian-Universität, Am Coulombwall 1, 85748 Garching, Germany
Abstract:We report on recent developments of an “at wavelength” full-field imaging technique for defect inspection of multilayer mask blanks for extreme ultraviolet lithography (EUVL). Our approach uses photoemission electron microscopy (PEEM) in a near normal incidence mode at 13.5 nm wavelength to image the photoemission induced by the EUV wave field on the multilayer blank surface. We analyze buried defects on Mo/Si multilayer samples down to a lateral size of 50 nm and report on first results obtained from a six inches mask blank prototype as prerequisite for industrial usage.
Keywords:Extreme ultraviolet lithography (EUVL)  Photoemission electron microscopy (PEEM)  EUV-PEEM  Defect analysis  Multilayer mask blanks
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