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Novel urethane/epoxy resin hybrid materials using a moisture‐curing system
Authors:Hiroyuki Okuhira  Nobuaki Iwamoto  Mitsukazu Ochi  Hidekazu Takeyama
Abstract:Novel curing systems of a urethane/epoxy resin diglycidyl ether of bisphenol A (DGEBA)] alloy using the moisture‐latent hardener ketimine (K‐systems) were investigated on the DGEBA‐rich side and were compared with aromatic diamine curing systems (A‐systems). Almost all the added DGEBA was separated from the polyurethane matrix and dispersed as 2–10‐μm‐diameter particles after curing in the A‐systems. Therefore, DGEBA did not act as a reinforcing agent for the polyurethane matrix. However, 50% of the added DGEBA was dispersed as particles with a diameter of 1–4 μm, and the other 50% was incorporated into the polyurethane matrix in the novel K‐systems. Therefore, the polyurethane matrix in the K‐systems should be reinforced effectively by both incorporated and finely dispersed DGEBA and should result in significant improvements in the stress–strain properties. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1137–1144, 2004
Keywords:epoxy  polyurethanes  ketimine  alloys  morphology
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