Analysis of low Z elements on Si wafer surfaces with undulator radiation induced total reflection X-ray fluorescence at the PTB beamline at BESSY II

Synchrotron radiation induced TXRF allows the nondestructive investigation of low Z contaminations on Si wafer surfaces at trace levels required by the semiconductor industry. The PTB (Physikalisch Technische Bundesanstalt) U180 undulator beamline at BESSY II, equipped with a plane grating monochromator ensuring an energy resolving power E/ΔE between 500 and 5000, can be operated either in wiggler mode for photon energies up to 1.7 keV to excite Al, Mg and Na efficiently, or in undulator mode, i.e. using one of the first odd U180 harmonics, to obtain intensive low energy radiation below 0.7 keV to excite carbon, nitrogen and oxygen. The specific feature of the beamline is its high spectral purity that allows for fundamental investigations. The TXRF wafer chamber of the Atominstitut was used for the experiments with a sidelooking Si(Li) detector with the wafer arranged vertically to take advantage of the linear polarization for background reduction. The energy dependence of the resonant Raman scattering, which is a limiter for the determination of Al at ultra trace levels excited with energies just below the Si absorption edge was studied as well as the influence of the incidence angle on the Raman peak. Droplet samples containing boron were measured and the detection limit of 3 ng determined. A single Carbon layer (5 nm) and a C–Ni–C multilayer sample on a Si wafer were characterized and it was shown that the thickness and density of these layers could be determined.