Periodic cracks and temperature-dependent stress in Mo/Si multilayers on Si substrates

This work examines formation of the peculiar periodic crack patterns observed in the thermally loaded Mo/Si multilayers. Using the substrate curvature measurements, the macroscopic film stress evolution during thermal cycling was investigated. Then high-speed microscopic observation of crack propagation in the annealed Mo/Si multilayers was presented providing experimental evidence of the mechanism underlying formation of the periodic crack patterns. The origin of the peculiar periodic crack patterns was determined. They were observed to form by the slow crack propagation under quasi-static conditions as a result of the interaction between the channelling crack propagation and the advance of the delamination front.