Electroelastic Analysis of an Internal Interface Crack in a Half-Plane Consisting of Two Bonded Dissimilar Piezoelectric Quarter-Planes |
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Authors: | Li X.-F. |
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Affiliation: | (1) College of Mathematics and Physics, Hunan Normal University, Changsha; Hunan, 410081, P.R. China |
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Abstract: | The problem of an interface crack in a half-plane consisting of two bonded dissimilar piezoelectric quarters is considered under antiplane shear and inplane electric loading. The problem is solved under the electrically permeable assumption for a crack. The integral transform technique is employed to reduce the problem to triple integral equations, which is further converted to a hypersingular integral equation for the crack sliding displacement. By solving the resulting equation analytically, the electroelastic field along the interface and the energy release rate are obtained in explicit form, respectively. Several examples are given to illustrate the influence of the material properties and the crack position on the energy release rate. |
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Keywords: | Interface crack Energy release rate Piezoelectric material Antiplane deformation Mechanics of solids |
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