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Preparation and characterization of novel polyimide‐silica hybrids
Authors:Toheed Akhter  Shaukat Saeed  Humaira Masood Siddiqi  O Ok Park
Institution:1. Department of Chemistry, Quaid‐i‐Azam University, , Islamabad, 45320 Pakistan;2. Department of Metallurgy and Materials Engineering, Pakistan Institute of Engineering and Applied Sciences (PIEAS), , Islamabad, 45650 Pakistan;3. Department of Chemical and Bimolecular Engineering, Korean Advance Institute of Science and Technology, , Yuseong‐gu, Daejeon, 305‐701 Republic of Korea;4. Department of Energy Systems Engineering, Daegu Gyeongbuk Institute of Science and Technology, , Dalseong‐gun, Daegu, 711‐873 Republic of Korea
Abstract:Polyimide‐silica (PI‐SiO2) hybrids were prepared from a novel polyimide (PI), derived from pyromellitic dianhydride (PMDA), 1,6‐bis(4‐aminophenoxy)hexane (synthesized) and 4,4′‐oxydianiline. SiO2 networks (5–30 wt%) were generated through sol–gel process using either tetraethylorthosilicate (TEOS) or a mixture of 3‐aminopropyltriethoxysilane‐PMDA‐based coupling oligomers (APA) and TEOS. Thin, free standing hybrid films were obtained from the respective mixtures by casting and curing processes. The hybrid films were characterized using Fourier transform infrared, 29Si nuclear magnetic resonance (NMR), field emission scanning electron microscopy (FE‐SEM), energy dispersive X‐ray spectrometry and atomic force microscopy (AFM) techniques. 29Si NMR results provide information about formation of organically modified silicate structures that were further substantiated by FE‐SEM and AFM micrographs. Contact angle measurements and thermogravimetric thermograms reveal that the addition of APA profoundly influences surface energy, interfacial tension, thermal stability and the residual char yield of modified hybrids in comparison to those obtained by mixing only TEOS. It was found that reduced particle size, efficient dispersion and improved interphase interactions were responsible for the eventual property enhancement. Copyright © 2012 John Wiley & Sons, Ltd.
Keywords:polyimide‐silica hybrid  microstructure  surface morphology  thermal stability
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