包覆型纳米铜-银双金属粉研究

目前,导电胶或者电磁波屏蔽涂料用的导电性填料主要有三类,一是铜粉,二是银粉,三是铜-银双金属粉。铜粉具有来源广、价格低廉、导电性好等优点,但其抗氧化性能弱;银粉导电性与抗氧化性好,但其资源日益匮乏。大量的研究试图通过对铜粉进行表面改性来提高其性能。表面改性有两种方法,一是包膜处理,用SiO2溶胶处理铜粉,铜粉抗氧化性能提高,但其表面导电性能大大降低犤1犦;另一类方法是在铜粉表面覆盖一层导电性能与抗氧化性能均佳的银或金而制成双金属粉末犤2～5犦。制取高性能的铜-银双金属粉是该领域的研究重点。目前获得铜-银双金属粉的方…

Study on Ag coating Cu Nano Bimetallic Powders

The resource comes from waste cupric liquor produced in the process of manufacturing printed circuit board(PCB). In the liquid phase, we get high pureness and excellent property nano-Cu with the hydrazine dydrate as the reducer and the PVP and OP-10 as the dispersant. After the nano-Cu is sensitized and acted, the nano Cu-Ag Bimetallic Powders are got through 5% PVP and OP-10 are went into the plating solution and they are chemic plating. It is stated by the experimentation result that the powders can substitute Ag as the padding of conduction coating or shield coating.