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Evaluation of interfacial toughness curve of bimaterial in submicron scale |
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| Authors: | Van Truong Do Hiroyuki Hirakata Takayuki Kitamura Van Thanh Vuong Van Lich Le |
| Institution: | 1. Department of Design of Machinery and Robot, School of Mechanical Engineering, Hanoi University of Science and Technology, Viet Nam;2. International Centre for Computational Materials Science, Hanoi University of Science and Technology, Viet Nam;3. Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0824, Japan;4. Department of Mechanical Engineering and Science, Kyoto University, Yoshida-hommachi, Sakyo-ku, Kyoto 606-8501, Japan |
| Abstract: | A novel method combining the experimental data at only two different mixed mode fractures and an empirical interface toughness function has been proposed to establish the interfacial toughness function of a bimaterial in submicron scale. The modified four-point bend specimen was used in experiment to evaluate the first type of mixed mode fracture, while the sandwiched cantilever specimen was employed to get the second one. An empirical interface toughness function reflecting quite accurately the delamination behavior was adopted as a typical one. The obtained results investigated that the proposed method could be used to calibrate not only the interfacial fracture criteria at pure modes but also at any mixed mode fracture of bimaterials in submicron scale. |
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