Ti基化学镀Ni-P和Ni-P-Cg镀层晶化动力学

利用化学镀技术在Ti基体材料表面制备了Ni-P合金镀层和Ni-P-Cg复合镀层。利用SEM、XRD和EDS等分析了镀层的晶化过程，用差热分析仪研究了Ni-P合金镀层和复合镀层的晶化动力学，运用Ozawa、Freeman-Carroll、Achar和Coats-Redfern方法对非等温动力学数据进行了分析和比较。结果发现，复合镀层的特征温度T_m和晶化激活能E均高于Ni-P合金镀层，而热焓值｜ΔH｜却低于Ni-P镀层；计算出Ni-P合金镀层和Ni-P-Cg复合镀层晶化激活能分别为308.9 kJ·mol^-1和412.99 kJ·mol^-1、指前因子A分别为58.03 s^-1和77.84 s^-1，确定了Ni-P合金镀层和复合镀层晶化动力学方程。

Crystallization Kinetics of Electroless Ni-P and Ni-P-Cg Composite Coating on Titanium

Ni-P alloy coatings and Ni-P-Cg composite coatings on titanium surface were obtained by electroless plating method. The crystallization processes of coatings were analyzed by SEM, XRD and EDS. The crystallization kinetics of coatings was studied by differential thermal analysis. The data of non-isothermal kinetics were analyzed and compared by methods of Ozawa, Freeman-Carroll, Achar and Coats-Redfern. The results indicate that characteristic temperature T_m and crystallization activation energy E of Ni-P-Cg coating are higher than Ni-P coatings, while the enthalpy value is lower. The kinetic equations were determined, giving crystallization activation energies of Ni-P coating and Ni-P-Cg coating of 308.90 kJ·mol^-1 and 412.99 kJ·mol^-1, respectively, and pre-exponential factors A of 58.03 s^-1 and 77.84 s^-1, respectively.