Experimental study of optimum spacing problem in the cooling of simulated electronic package |
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Authors: | S Chen Y Liu S F Chan C W Leung T L Chan |
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Institution: | (1) Department of Mechanical Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon, Hong Kong, HK |
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Abstract: | An experimental investigation has been performed to determine the effects of different arrangements of obstacles on the
cooling of simulated electronic package. The considered simulated electronic package consisted of a channel formed by two
parallel plates. The bottom plate is attached with five identical electrically heated square obstacles, which are perpendicular
to the mean airflow and arranged with different side-to-side distances. The experimental results show that the conventional
equi-spaced arrangement might not be the optimum option and should be avoided. A better thermal performance could be obtained
when the side-to-side distances between the obstacles followed a geometric series. For example, at Re=800, the highest temperature
of the optimum arrangement could be reduced by 12% compare to the equi-spaced arrangement and the maximum temperature difference
among the five obstacles is lower than that of equi-spaced arrangement by 32.1%.
Received on 17 December 1999 |
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