Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology |
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| Institution: | 1. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, PR China;2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, PR China;3. School of Material Sciences & Engineering, Henan University of Technology, Zhengzhou, 450007, Henan, China;4. School of Materials Science and Chemical Engineering, Ningbo University, Ningbo, 315211, China;1. Research Center of Nanoscience and Nanotechnology, Shanghai University, 99 Shangda Road, Shanghai 200444, PR China;2. College of Sciences, Shanghai University, 99 Shangda Road, Shanghai 200444, PR China;1. Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy NY 11280, United States;2. U.S. Army Armaments Research Development and Engineering Center, Benet Laboratories, Watervliet, NY 12189, United States |
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| Abstract: | Dielectric polymers with high thermal conductivity are very promising in the fields of aerospace and electronic device packaging. However, composites with excellent dielectric properties usually have low thermal conductivity. It is usually to fill the polymer with thermal conductivity particles to improve the thermal conductivity, but the high content of filler often reduces the mechanical properties of the polymer. In this paper, the traditional insulating polymer epoxy resin was used as the matrix, by covering the surface of silicon carbide with graphene to form a core-shell structure and co-filled with nano diamonds to achieve the preparation of high-performance epoxy resin at low content. The results showed that at the filling content of 30 wt%, the thermal conductivity of epoxy nanocomposites showed a dramatic thermal conductivity enhancement of 1263%, the energy storage modulus increased by 1.1 GPa, and the dielectric loss remained unchanged at 50 Hz. The advantages of the composite are the structural design and surface modification of the filler, which not only take advantage of its inherent advantages, but also improve the interface area with the epoxy matrix. The composite materials with excellent properties are expected to provide theoretical guidance for the application of high thermal conductivity dielectric materials. |
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| Keywords: | Nanocomposites Epoxy resin High thermal conductivity Delectric property Graphene |
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