Influence of thermal treatment on the glass transition temperature of thermosetting epoxy laminate

The influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex^® FR-4 glass fibre-reinforced epoxy laminate (used for printed circuit board manufacturing) was used in these experiments. The composite was exposed to thermal treatments at temperatures ranging from 170 °C to 200 °C for times ranging from 10 to 480 h. The glass transition temperature (T_g) was analysed via dynamic mechanical analysis (DMA). It has been proven that the glass transition temperature rapidly decreases in reaction to thermal stress. The obtained T_g data were used for Arrhenius plots for different critical temperatures (T_g-crit. = 105–120 °C). From their slopes (?E_a/R), the activation energy of the thermal degradation process was calculated as 75.5 kJ/mol. In addition to this main relaxation mechanism, DMA also recorded one smaller relaxation process in the most aged samples. Microscopic analysis of the sample structure showed the presence of pronounced small regions of degradation both on the surface and in the inner structure, which are probably the causes of microscopic delamination and the smaller relaxation process.