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Study of shear transfer in Al/epoxy joint by digital photoelasticity
Authors:Zhenkun Lei  Hai Yun  Yanru Zhao  Yongming Xing  Xuemin Pan
Affiliation:1. Department of Engineering Mechanics, State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Linggong Road 2#, Ganjingzi District, Dalian 116024, China;2. School of Transportation and Vehicle Engineering, Shandong University of Technology, Zibo 255049, China;3. College of Science, Inner Mongolia University of Technology, Hohhot 010051, China;4. State key Laboratory of Materials Modification, Dalian University of Technology, Dalian 116024, China
Abstract:An improved six-step phase-shifting method is proposed for calculating full-field shear stress based on a four-step color phase-shifting method in digital photoelasticity. The method was verified using a disk under diametral compression and then applied to an aluminum alloy/epoxy joint for studying the shear transfer behavior. Experimental results revealed that the isochromatic fringe order and shear stress at the bonding interface are distributed continuously and increased with compression. In particular, an antisymmetric thermal residual shear stress appears at the bonding interface, because of the difference in the thermal expansion coefficients of Al and the resin. This indicates that the thermal residual shear stress at the bonding interface is self-balanced and reaches a peak at the edges of the bonding interface. The load transfer is realized by the shear band from the bonding interface to the bottom support. Basically, the bonding interfacial shear stress is balanced with the load.
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