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n型砷化镓微区光电化学腐蚀过程
引用本文:王卫江,王江涛,金承和,陆寿蕴.n型砷化镓微区光电化学腐蚀过程[J].物理化学学报,1993,9(3):386-391.
作者姓名:王卫江  王江涛  金承和  陆寿蕴
作者单位:Department of Chemistry, Fudan University, Shanghai 200433
摘    要:在n-GaAs电解液界面,用聚焦He-Ne激光照射, 使n-GaAs表面发生微区光电化学腐蚀, 用计算机控制步进马达, 使试样在X-Y二维方向扫描移动, 能在晶片上得到刻蚀点直径2 μm的刻蚀图案. 研究了激光相对光强, KOH、H_2SO_4、KCl等刻蚀剡的浓度, 光腐蚀的时间, 电极电位等因素对腐蚀点的直径和深度的影响, 通过实验数据找出腐蚀过程的规律, 并用光电化学原理进行解释.

关 键 词:光电化学腐蚀  半导体微刻蚀  光助微刻蚀  n-GaAs无掩模刻蚀  
收稿时间:1992-01-08
修稿时间:1992-08-30

PHOTOELECTROCHEMICAL MICROETCHING OF n-GaAs
Wang Weijiang Wang Jiangtao Jin Chenghe Lu Shouyun.PHOTOELECTROCHEMICAL MICROETCHING OF n-GaAs[J].Acta Physico-Chimica Sinica,1993,9(3):386-391.
Authors:Wang Weijiang Wang Jiangtao Jin Chenghe Lu Shouyun
Institution:Department of Chemistry, Fudan University, Shanghai 200433
Abstract:Microphotoelectrochemical etching of n-GaAs by focused He-Ne laser was inven-stigated. An etched pattern was scribed on the n-GaAs surface while the sample moved in X-Y two directions by means of two motors controlled by microcomputer. The diameter of the etched holes was 2 μm. The intensity of the laser light, the concen-trations of different etchants, such as KOH, _2SO_4, HCl and KCl etc., the etching time, the electrode potentials effected the diameters and depths of the etched holes. The experiment results were discussed and analyzed in this paper.
Keywords:Photoelectrochemical etching  Microetching of semiconductor  Photoassisted microetching  Non-mask etch of n-GaAs
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