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Phenolic resins bearing maleimide groups: Synthesis and characterization
Authors:R. L. Bindu  C. P. Reghunadhan Nair  K. N. Ninan
Abstract:
Novel phenolic novolac resins, bearing maleimide groups and capable of undergoing curing principally through the addition polymerization of these groups, were synthesized by the polymerization of a mixture of phenol and N‐(4‐hydroxy phenyl)maleimide (HPM) with formaldehyde in the presence of an acid catalyst. The polymerization conditions were optimized to get gel‐free resins. The resins were characterized by chemical, spectral, and thermal analyses. Differential scanning calorimetry and dynamic mechanical analysis revealed an unexpected two‐stage curing for these systems. Although the cure at around 275°C was attributable to the addition polymerization reaction of the maleimide groups, the exotherm at around 150 to 170°C was ascribed to the condensation reaction of the methylol groups formed in minor quantities on the phenyl ring of HPM. Polymerization studies of non‐hydroxy‐functional N‐phenyl maleimides revealed that the phenyl groups of these molecules were activated toward an electrophilic substitution reaction by the protonated methylol intermediates formed by the acid‐catalyzed reaction of phenol and formaldehyde. On a comparative scale, HPM was less reactive than phenol toward formaldehyde. The presence of the phenolic group on N‐phenyl maleimide was not needed for its copolymerization with phenol and formaldehyde. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 641–652, 2000
Keywords:phenolic resin  addition‐cure phenolics  imide‐functional phenolic resin  hydroxy phenyl maleimide  matrix resin
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