功率型LED封装用高分子材料的研究进展

随着发光二极管(LED)亮度和功率的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料,要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。

Research Progress of Polymer Materials for High-Power LED Encapsulation

With the development of high-power light emitting diode （HP-LED）, the packaging material of LED has become an important key technique for LED lighting in daily life. As for high-power LED, the characteristics of high refractive index, high transmittance, high thermal conductivity, excellent UV/thermal resistance, low stress and water absorption are required. At present, the polymer materials for LED packaging mainly included epoxy resins and organosilicones, and a lot of researches about modifications of them are focused on improving the refractive index, aging resistance, thermal conductivity, water absorption and mechanical property to satisfy the demands of high-power LED packaging. Among the materials, cycloaliphatic epoxy resins and nano-composite of organosilicones have wide development prospections for high-power LED encapsulations.