Microstructure and transport properties of various 90° grain boundaries in YBa2Cu3O7 thin films |
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| Authors: | C. B. Eom Julia M. Phillips A. F. Marshall T. H. Geballe |
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| Affiliation: | (1) AT&T Bell Laboratories, 07974 Murray Hill, NJ;(2) Center for Materials Research, Stanford University, 94305 Stanford, CA;(3) Department of Applied Physics, Stanford University, 94305 Stanford, CA;(4) Present address: Department of Mechanical Engineering and Material Science, Duke University, 27708 Durham, NC |
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| Abstract: | The microstructure and transport properties of various 90° grain boundaries in (103) oriented YBa2Cu3O7(YBCO) thin films grown epitaxially in situ by 90° off-axis sputtering are compared. The (103) films grown on (101) LaAlO3 and (101) SrTiO3 substrates have specific sets of 90° grain boundaries in both principal in-plane directions: 90° [010] twist boundaries along the [101] direction, and 90° [010] symmetrical tilt boundaries and 90° [010] basal-plane-faced tilt boundaries along the (301) direction. No weak-link behavior is observed across some of these boundaries by transport critical current density and normalized magnetic field dependence of Jc measurements along both those in-plane directions. High-resolution transmission electron microscopy reveals variations in the structure and microfaceting of the 90° boundaries, which may contribute to the absence of weak-link behavior. These results have important implications for understanding the behavior of step-edge Josephson junctions. |
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| Keywords: | thin films high temperature superconductor grain boundaries microstructure transport properties |
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