Preparation and Thermal Properties of Boron-Containing o-Cresol-Formaldehyde Resin/Octa(aminophenyl)-POSS Nanocomposites

The boron-containing o-cresol-formaldehyde resin (BoCFR) and octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP-POSS) were synthesized, and the BoCFR/OAP-POSS nanocomposite prepared via an in-situ method. The curing process of the resin was characterized by Fourier transform infrared (FTIR). The thermal properties and dynamic mechanical properties of the nanocomposites were investigated. The results show that the maximal mechanical loss temperature (T_p) increased with increasing OAP-POSS content. When the content of OAP-POSS was 10 wt% the T_p was over 200°C, 27°C higher than the pure BoCFR. The BoCFR/OAP-POSS nanocomposite had better thermal stablitity than the pure BoCFR. The residual weight of the o-cresol-formaldehyde resin was only 6.13 wt% at 600°C. But the residual weight of the pure BoCFR was 55.73 wt% at 600°C, and the residual weights of the BoCFR nanocomposites were all higher than pure BoCFR. The residual weight of the BoCFR nanocomposite was 63.2 wt% at 600°C and 21.83 wt% at 900°C when the OAP-POSS content was 10 wt%. The weight loss of BoCFR/OAP-POSS nanocomposite can be divided primarily into two temperature stages, from 430°C to 550°C and from 550°C to 900°C. The main thermal degradation reaction follows first order kinetics.