Study of cure kinetics of epoxy/DDS/nanosized (SiO2/TiO2) system by dynamic differential scanning calorimetry |
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| Authors: | M. A. Safarpour A. Omrani S. Afsar D. Zare‐Hossein‐Abadi |
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| Affiliation: | 1. Department of Physical Chemistry, Faculty of Chemistry, Iran University of Science and Technology (IUST), Narmak, Tehran, Iran;2. Faculty of Chemistry, University of Mazandaran, P.O. Box 453, Babolsar, Mazandaran, Iran;3. Iran Polymer and Petrochemical Institute, Iran |
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| Abstract: | In this study the curing kinetics of epoxy based on the diglycidyl ether of bisphenol A (DGEBA), 4,4′‐diaminodiphenyl sulfone (DDS) as a hardener, and SiO2/TiO2 (70:30) as a nanofiller was investigated by nonisothermal differential scanning calorimetry (DSC). The effects of different weight contents of SiO2/TiO2 nanoparticles were studied using DSC in Dynamic Mode and the best value of the nanofiller was found to be 5 phr (parts per hundred). Dynamic measurements were used to obtain the total heat of reaction of the epoxy system as well as its activation energy (Ea) based on the isoconversional methods of Kissinger and Ozawa. The process revealed a dependence of the activation energy on conversion (α). The morphology of the cured system was investigated by scanning electron microscopy (SEM). It showed a strong cross‐linking between the resin and hardner and a relatively better dispersion of surface modified filler nanoparticles. Copyright © 2009 John Wiley & Sons, Ltd. |
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| Keywords: | epoxy resin differential scanning calorimetry (DSC) nanosized SiO2/TiO2 diaminodiphenyl sulfone (DDS) cure kinetics |
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