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Controlled growth of rutile TiO2 by atomic layer deposition on oxidized ruthenium
Authors:Mihaela Popovici  Johan Swerts  Kazuyuki Tomida  Dunja Radisic  Min‐Soo Kim  Ben Kaczer  Olivier Richard  Hugo Bender  Annelies Delabie  Alain Moussa  Christa Vrancken  Karl Opsomer  Alexis Franquet  Malgorzata A. Pawlak  Marc Schaekers  Laith Altimime  Sven Van Elshocht  Jorge A. Kittl
Affiliation:imec, Kapeldreef 75, 3001, Leuven, Belgium
Abstract:Crystalline rutile TiO2 films were grown by atomic layer deposition on oxidized Ru electrodes using a titanium methoxide as the metal precursor and O3 as the oxidant. A protective layer of ~0.3 nm TiO2 grown with H2O as the oxidant was first deposited in order to avoid etching of the Ru bottom electrode by the O3 used for the growth of the TiO2 (bulk) layer. Electrical evaluation of the capacitor stacks with TiO2 as dielectric, RuO2/Ru and Pt as the bottom and top electrodes respectively, resulted in superior characteristics of the rutile phase as compared to the anatase. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Keywords:atomic layer deposition  high‐k dielectrics  rutile TiO2
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