| 电化学制备Ni-Cu/Cu超晶格多层膜 |
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| 引用本文： | 喻敬贤,陈永言,黄清安,杨汉西.电化学制备Ni-Cu/Cu超晶格多层膜[J].武汉大学学报(理学版),1998(6). |
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| 作者姓名： | 喻敬贤 陈永言 黄清安 杨汉西 |
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| 作者单位： | 武汉大学化学学院 |
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| 摘 要： | 采用单槽双脉冲恒电位制备了超晶格Ｎｉ－Ｃｕ／Ｃｕ多层膜，测试结果表明：Ｎｉ－Ｃｕ层与Ｃｕ层间界面清晰，各层均匀连续、相互覆盖，具有良好的周期结构；Ｎｉ－Ｃｕ４．６ｎｍ／Ｃｕ１．４ｎｍ是具有良好外延生长的超晶格结构，铜、镍生长的择优取向面为［１１１］晶面，该材料表现出特殊的阳极溶解性能．
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| 关 键 词： | 电沉积，Ni－Cu／Cu，超晶格，多层膜 |
SINGLE BATH ELECTRODEPOSITION OF Ni Cu/Cu SUPERLATTICE MULTILAYERS BY DUAL POTENTIAL PULSE TECHNIQUE |
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| Yu Jingxian,Chen Yongyan,Huang Qing'an,Yang Hanxi.SINGLE BATH ELECTRODEPOSITION OF Ni Cu/Cu SUPERLATTICE MULTILAYERS BY DUAL POTENTIAL PULSE TECHNIQUE[J].JOurnal of Wuhan University:Natural Science Edition,1998(6). |
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| Authors: | Yu Jingxian Chen Yongyan Huang Qing'an Yang Hanxi |
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| Abstract: | The preparation of Ni Cu/Cu superlattice multilayers have been achieved in single bath by dual potential pulse technique. Results showed that there is a clear interface between Ni Cu and Cu layers, and every sublayer is homogeneous and continuous with good periodicity in this multilayers. The Ni Cu 4.6nm /Cu 1.4nm exhibits superlattice structure with epitaxial growth and has very different anodic behavior, specially showing strong corrision resistent properties. |
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| Keywords: | electrodeposition Ni Cu/Cu superlattice multilayers |
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