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Comparative analysis of characteristics of Si, Mg, and undoped GaN
Authors:K. S. Kim   C. S. Oh   W. -H. Lee   K. J. Lee   G. M. Yang   C. -H. Hong   E. -K. Suh   K. Y. Lim   H. J. Lee  D. J. Byun
Affiliation:

a Department of Semiconductor Science and Technology, Semiconductor Physics Research Center, Chonbuk National University, Chonju 561-756, South Korea

b Department of Materials Science and Engineering, Korea University, 1, 5-Ka, Anam-Dong, Sungbuk-Ku, Seoul 136-701, South Korea

Abstract:We have grown undoped, Si- and Mg-doped GaN epilayers using metalorganic chemical vapor deposition. The grown samples have electron Hall mobilities (carrier concentrations) of 798 cm2/V s (7×1016 cm−3) for undoped GaN and 287 cm2/V s (2.2×1018 cm−3) for Si-doped GaN. Mg-doped GaN shows a high hole concentration of 8×1017 cm−3 and a low resistivity of 0.8 Ω cm. When compared with undoped GaN, Si and Mg dopings increase the threading dislocation density in GaN films by one order and two orders, respectively. Besides, it was observed that the Mg doping causes an additional biaxial compressive stress of 0.095 GPa compared with both undoped and Si-doped GaN layers, which is due to the incorporation of large amount of Mg atoms (4–5×1019 cm−3).
Keywords:Undoped GaN   GaN : Si   GaN : Mg   Characteristics
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