A general model of metal underpotential deposition in the presence of thiol-based additives based on an in situ STM study

Bis(3-sulfopropyl)disulfide (SPS) is a common additive in commercial copper electroplating baths. We have studied the influence of SPS on Cu underpotential deposition (UPD) on a Au(111) single crystal surface by means of cyclic voltammetry (CV) and electrochemical scanning tunneling microscopy (EC-STM). By combining our results with the results from the literature we propose a model that describes different stages of Cu UPD in the presence of SPS. Further analysis shows that our model is also applicable to a more general case of UPD of different metals, e.g. Cu and Ag, on a thiol-modified single-crystal surface, where the bond between the substrate and the thiol is adatom mediated. In addition, we have verified our model by in situ observation of the lifting of the Herringbone reconstruction on the Au(111) surface by Cu UPD.