Silicon substrate temperature effects on surface roughness induced by ultrafast laser processing

We report the effect of substrate temperature (T_sub) in the range 300-900 K on the surface roughness of silicon wafer resulted from femtosecond laser ablation. The surface roughness observed at the laser fluences less then 0.3 J/cm² increases with increasing T_sub. However, the surface roughness decreases with increasing T_sub for the laser fluences between 0.5 and 1.0 J/cm². If the laser fluence is higher than 2.0 J/cm², the surface roughness is independent of T_sub. The effect of T_sub on the surface roughness can be understood in terms of the temperature dependence of optical absorption coefficient of silicon substrate, which eventually alters a mechanism underlying the fs-laser-material ablation process between optical penetration and thermal diffusion processes.