新型沟槽道微热管散热性能实验研究

微热管以其效率高、响应快且无能耗,在高功率集成微电子散热方面应用广泛。针对电子器件的小型化、高能耗发展趋势,本文提出一种新型沟槽道微热管结构,对该沟槽道微热管进行稳态和瞬态热性能实验研究,研究了风速、角度、加热功率等因素对该新型热管的热性能影响规律。结果表明,该微热管在整个散热器传热上起主导作用,性能比达到0.88,冷凝端温差为0.8℃,具有良好的均温性,该微热管加热功率为140 W,空气流速1.5 m/s时,换热系数可达2 359 W/(m^2·℃),热阻为0.27℃/W;高功率状态下可保持良好的热扩散性能,有效避免微热管的热应力集中,有望高效解决集成电子器件的散热问题。

Experimental study on heat dissipation performance of a new groove type of micro heat pipe

The micro heat pipe is widely used in heat dissipation, especially microelectronic heat dissipation, because of its high efficiency, fast response and no energy consumption. Aiming at the trend of miniaturization and high energy consumption of electronic devices, this paper proposes a novel micro heat pipe structure, and conducts experimental research on the steady state and transient performance of the micro channel heat pipe. The effects of wind speed, angle and heating power on the heat transfer of the novel heat pipe were studied experimentally. The results show that the micro heat pipe plays a leading role in the heat transfer of the whole radiator. The performance ratio is 0.88, the temperature difference at the condensation end is 0.8 ℃, and the temperature is good.The heating power of the micro heat pipe is 140 W and the air flow rate is 1.5 m/s, the heat transfer coefficient can reach 2 359 W/(m^2·℃) and the thermal resistance is 0.27 ℃/W, which indicates that the new micro-heat pipe can maintain good thermal diffusion performance under high power condition, which can effectively avoid the thermal stress concentration of the micro-heat pipe, and is expected to solve heat dissipation problems with integrated electronics.