航空高度FPGA单粒子翻转飞行实验及失效分析

随着微电子工艺的发展，小尺寸、高密度及低电压的器件越来越多地应用于航空电子设备。许多科研人员发现高层大气及外太空的带电粒子带来的粒子辐射会对航空电子器件产生严重的影响。基于民用航空局方的要求，鉴于机载设备对单粒子翻转效应的隐患以及航空机载设备国产化的迫切需求，开展FPGA器件用于机载电子设备可能遭遇的单粒子翻转效应的风险问题研究。分析了主流FPGA在航空飞行高度的飞行实验数据，进一步论证其是否满足民用航空的需求。大量数据的分析结果证明，以当下主流FPGA芯片的工艺尺寸、工作电压的条件，单粒子翻转效应是一个不容忽视的问题。即便是航空飞行高度甚至是地面高度，FPGA芯片因单粒子翻转导致失效也是无法满足民用航空设备的安全性要求。

Flight experiments and failure analysis of FPGA for anti-SEU at aviation altitudes

With the development of microelectronics technology, small size, high integration density and low voltage devices are increasingly used in avionics. Many researchers found that the particle radiation caused by the charged particles in upper atmosphere have a significant impact on avionic devices. In consideration of the potential safety hazard by single event upsets and the urgent demand of airborne equipment localization, this paper reports the research and analysis of the single event upset problems of FPGA devices applied in the airborne electronic equipment. Firstly, the flight experimental data of mainstream FPGAs at the aviation flight altitudes are analyzed. Then, further demonstration is made about whether these FPGA devices meet the needs of civil aviation. The analysis results show that single event upset is an indispensable problem according to the conditions of mainstream FPGA chip with the small size and working voltage. Even the FPGA devices are working at the air flight altitude or near the ground, the failure caused by single event upset would make them unable to meet the safety requirements of civil aviation equipment.