The anodic dissolution of tin in acidic chloride solutions |
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| Affiliation: | 1. Department of Electrical and Computer Engineering, Old Dominion University, Norfolk, VA 23529, United States of America;2. Applied Research Center, Old Dominion University, 12050 Jefferson Avenue, Newport News, VA 23606, United States of America;3. Thomas Jefferson National Accelerator Facility, Newport News, VA 23606, United States of America;4. Fermi National Accelerator Laboratory, Batavia, IL 60510, United States of America;1. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China;2. Department of Materials Science and Engineering Program, nanoEngineering, 9500 Gilman Drive, La Jolla, CA 92093, United States;1. China Ship Development and Design Center, No. 268, Zhangzhidong Road, Wuchang District, Wuhan, 430060, China;2. State Key Laboratory of Nuclear Physics and Technology, Peking University, Beijing 100871, China |
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| Abstract: | The anodic dissolution of Sn in acidic chloride solutions (pH = −2.0 to 2.9) was studied at 25 °C. The apparent valence of the dissolving ions varied from about 0.4 to 2.4, and was a function of both electrolyte and c.d. The complexing of Sn2+ by Cl− had an important influence, with SnCl−3 apparently being the dominant product. A reaction sequence is proposed involving the stepwise oxidation of Sn, accompanied by reaction with Cl−. |
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