| 现场表面拉曼光谱研究Ni-P合金电沉积机理 |
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| 引用本文： | 曾跃,姚士冰,周绍民.现场表面拉曼光谱研究Ni-P合金电沉积机理[J].物理化学学报,2000,16(2):175-179. |
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| 作者姓名： | 曾跃 姚士冰 周绍民 |
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| 作者单位： | State Key Laboratory for Physical Chemistry of the Solid Surface,Department of Chemistry,Xiamen University,Xiamen 361005,Department of Chemistry,Hunan Normal University,Changsha 410006 |
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| 基金项目： | 国家自然科学基金!(59605006) |
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| 摘 要： | 由于Ｎｉ Ｐ合金具有许多优越的物理和化学性能 ,如高的耐蚀性［１］、好的电催化特性［２，３］以及好的非磁特性［４，５］,人们对这种合金的沉积方法进行了大量的研究．磷是一种不能从水溶液中单独进行电沉积的元素 ,但它很容易和铁组元素共沉积．为了解释这一现象 ,Ｂｒｅｎｎｅｒ曾提出直接机理［６］．认为镀液中磷的含氧酸 (根 )直接在电极上还原成合金中的磷．然而 ,磷不能用电化学方法以纯态沉积出来，所以直接机理没有被广泛接受．第二种是由Ｆｅｄｏｔ′ｅｖ等提出的间接机理［７］,认为磷的含氧酸（根）首先还原成磷化氢（ＰＨ…
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| 关 键 词： | 现场拉曼光谱 电沉积 Ni-P合金 共沉积机理 |
| 收稿时间： | 1999-04-05 |
| 修稿时间： | 1999-06-14 |
In Situ Surface Raman Spectroscopy Study of Electrodeposition Mechanism of Ni-P Alloys |
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| Zeng Yue,YAO Shibing,ZHOU Shaomin.In Situ Surface Raman Spectroscopy Study of Electrodeposition Mechanism of Ni-P Alloys[J].Acta Physico-Chimica Sinica,2000,16(2):175-179. |
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| Authors: | Zeng Yue YAO Shibing ZHOU Shaomin |
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| Institution: | State Key Laboratory for Physical Chemistry of the Solid Surface,Department of Chemistry,Xiamen University,Xiamen 361005|Department of Chemistry,Hunan Normal University,Changsha 410006 |
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| Abstract: | Codeposition mechanism of phosphorus with nickel on an Ni-Ag alloy electrode has been investigated by means of in situ surface enhanced Raman spectroscopy(SERS) and electrochemical method to obtain new information about the phosphorus incorporation mechanism during electrodeposition of Ni-P alloys.The intermediate,Ni(PH3)n,in the electrodeposition of Ni-P alloy was detected with in situ surface Raman spectroscopy for the first time. The experimental results showed that in the solution without NiSO4,hypophosphite was reduced only to Ni phosphine compound,while in the case where NiSO4 coexisted in the solution,the Ni-phosphine compound,as an intermediate,was oxidized by Ni2＋ to elemental phosphorus in alloys with nickel acting as the catalyst. |
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| Keywords: | In situ Raman Spectroscopy Electrodeposition Ni-P alloy Codeposition mechanism |
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