Investigation of peculiarities of sealant thermal degradation under conditions of high-temperature aging modes |
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| Authors: | V. G. Tsverava M. Yu. Rusin P. A. Stepanov V. I. Nepovinnykh A. S. Khamitsaev |
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| Affiliation: | (1) Shanghai Key Laboratory of Functional Materials Chemistry, East China University of Science and Technology, Shanghai, 200237, People’s Republic of China; |
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| Abstract: | ![]()
Investigations on the relationship between the adhesive and thermal chemical properties of Viksint U-2-28NT sealant at high-temperature modes of adhesive joint aging are presented. It is shown that, under these conditions, if nonporous substrates are used, an abnormal thermal oxidative reaction takes place both in the volume of the adhesive, i.e., Viksint U-2-28NT sealant, and at the interphase boundary of the adhesive joint. |
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