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Surface etching induced by Ce silicide formation on Si(1 0 0)
Authors:Dohyun Lee  G Lee  Chanyong Hwang  Hangil Lee
Institution:a Advanced Industrial Technology Group, Division of Advanced Technology, Korea Research Institute of Standards and Science, Daejeon 305-600, Republic of Korea
b Department of Chemistry and School of Molecular Science (BK21), Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea
c Department of Physics, Inha University, Inchon 402-751, Republic of Korea
d Beamline Research Division, Pohang Accelerator Laboratory (PAL), POSTECH, Pohang, Kyongbuk 790-784, Republic of Korea
Abstract:We investigate the temperature-dependent surface etching process induced by Ce silicide on Si(1 0 0) using scanning tunneling microscopy and X-ray photoelectron spectroscopy. We found that step edges on the Si(1 0 0) surface are gradually roughened due to the formation of Ce silicide as a function of substrate temperature. Unlike the Si(1 1 1) surface, however, terrace etching also occurs in addition to step roughening at 500 °C. Moreover, we found that Si(1 0 0) dimers are released and formed dimer vacancy lines because bulk diffusion of Ce silicide into Si(1 0 0) surface occurs the defect-induced strain at higher temperature (∼600 °C).
Keywords:Surface etching  STM  XPS  DVL  Step roughening
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