Adhesive and dielectric properties of novel polyimides with bis(3,3′-aminophenyl)-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO) |
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Authors: | Jun Keol Choi |
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Institution: | Department of Materials Science and Engineering, Gwangju Institute of Science and Technology, 1, Oryong-dong, Buk-gu, Gwangju 500-712, Republic of Korea |
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Abstract: | Polyimides with a low dielectric constant and excellent adhesion were prepared from a diamine containing phosphine oxide and fluorine groups, bis(3,3′-aminophenyl-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO), and rigid-rod type dianhydride containing fluorine groups, such as 3,6-di(3′,5′-bis(trifluoromethyl)-phenyl)pyromellitic dianhydride (12FPMDA). The polyimides were synthesized via the known two-step process, preparation of poly(amic-acid) followed by solution imidization, and characterized by FT-IR, NMR, DSC, TGA and TMA. In addition, their solubility, intrinsic viscosity, dielectric constant and adhesive property were also evaluated. For comparison, 3,6-di(4′-trifluoromethylphenyl) pyromellitic dianhydride (6FPMDA) and 3,6-diphenylpyromellitic dianhydride (DPPMDA) were also utilized. The prepared polyimides exhibited high Tg (276-314 °C), excellent thermal stability (>500 °C in air), good adhesive property (104.7-126.3 g/mm), good solubility, and very low dielectric constant (2.34-2.89). |
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Keywords: | Polyimide Phosphine oxide Fluorine Dielectric constant Adhesive property Peel strength |
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