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Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character |
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| Authors: | Jianjun Tian Liqiang Wan Jianzhi Huang Yanhong Hu Farong Huang Lei Du |
| Affiliation: | 1. Key Laboratory for Ultrafine Materials of Ministry of Education, The School of Material Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China;2. Key Laboratory for Ultrafine Materials of Ministry of Education, The School of Material Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of ChinaKey Laboratory for Ultrafine Materials of Ministry of Education, The School of Material Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China.;3. Shanghai Bureau of Astronautics, Shanghai 200233, People's Republic of China |
| Abstract: | A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature Tg and thermal decomposition temperature Td5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd. |
| Keywords: | thermosetting polytriazole resin low‐temperature curing polymer synthesis thermal and mechanical properties |