光子器件激光封装中热致角度偏移的降低

对光电子器件激光封装中光纤准直器的热致角度偏移进行了实验研究和理论分析.设计了一种新型的拱形焊接支承架,并对其热稳定性进行了测试.测试结果表明,在加载十个连续的温度循环周期后,其角度偏移为0.01°,而在同样的测试条件下,传统的鞍形支承架的角度偏移达到0.023°.采用非线性热—应力耦合有限元模型对封装结构中热应力的变化、残余应力的分布以及准直器角度偏移进行分析.理论分析结果与实验结果极好地吻合.进一步的理论计算得到新型拱形支承架的饱和热致角度偏移为0.043°,与传统鞍形支承架的0.065°相比得到了较大的降低.

Thermally Induced Misalignment in Laser Packaging of Optical Modules

The thermally-induced misalignment of fiber collimators in laser packaging of optical module under accelerated temperature cycle testing has been studied both experimentally and numerically. Two types of laser welding clips for fiber/fiber collimator,the saddle-shaped and the arch-shaped were employed in the testing. Experimental results showed that the fiber angular misalignment when using saddle-shaped clip is up to 0.023°after undergoing 10 temperature cycles,whereas the misalignment of arch-shaped is 0.01°,about tw two times less than that of the saddle-shaped. A nonlinear thermal-elasticity coupled finiteelement analysis (FEA)has also been utilized to analyze the properties of residual stresses and consequent angular misalignment of collimators. Experimental measurements of the collimator angular misalignment were in a good agreement with the FEA calculated results. The saturated thermally induced angular shift was calculated to be 0.043° for arch-shaped clip in comparison with 0.065° for saddle-shaped clip,and Von Mises stresses were also presented for the both kinds of clips. It was concluded that arch-shaped clip exhibits a 50% higher thermal stability in optical module packaging.