Thermal
analysis of vinyl siding |
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Authors: | L Judovits C C Crabb |
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Institution: | (1) Arkema Inc, King of Prussia, USA, 19406, PA, 900 First Avenue |
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Abstract: | Vinyl siding is typically
produced by co-extruding a capstock (surface layer) over a PVC substrate formulation.
The capstock is often non-PVC, these systems can result in warpage during
or after production. In our study we will show that this warpage can result
from an interfacial induced stress related to the mismatch between the glass
transition of the substrate and the capstock. Additionally, both TMA and TMDSC
were used to probe the stress release. Capstock formulations which better
match the glass transition of the PVC substrate result in superior performance. |
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Keywords: | capstock DSC glass transition PVC vinyl siding |
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