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Device linearity improvement and current enhancement utilizing high-to-low doping-channel FETs
Institution:1. Research Scholar in Dept. of EEE, Sathyabama Institute of Science and Technology, Chennai, India;2. Associate Professor in Dept. of EEE, Sathyabama Institute of Science and Technology, Chennai, India;1. Sandia National Laboratories, Albuquerque, NM 87185, USA;2. Sonrisa Research, Inc., Santa Fe, NM 87506, USA;1. IEMN, CNRS, Université de Lille, 59650 Villeneuve d''Ascq, France;2. CNRS, Grenoble INP, Institut Néel, Université Grenoble Alpes, 38000 Grenoble, France;3. CNRS, Institut Néel, Université de Toulon, Université Grenoble Alpes, 38000 Grenoble, France;4. EasyGAN SAS, Rue Bernard Grégory, 06905 Sophia Antipolis Cedex, France;5. CNRS, CRHEA, Université Côte d''Azur, rue Bernard Grégory, 06560 Valbonne, France
Abstract:We report device linearity improvement and current enhancement in both a heterostructure FET (HFET) and a camel-gate FET (CAMFET) using InGaAs/GaAs high-low and GaAs high-medium-low doped channels, respectively. In an HFET, a low doped GaAs layer was employed to build an excellent Schottky contact. In a GaAs CAMFET, a low doped layer together withn+andp+layers formed a high-performance majority camel-diode gate. Both exhibit high effective potential barriers of >1.0 V and gate-to-drain breakdown voltages of >20.0 V (atIg=1.0 mA mm−1). A thin, high doped channel was used to enhance current drivability and to improve the transconductance linearity. A 2×100 μm2HFET had a peak transconductance of 230 mS mm−1and a current density greater than 800 mA mm−1. The device had a transconductance of more than 80 percent of the peak value over a wide drain current range of 200 to 800 mA mm−1. A 1.5×100 μm2CAMFET had a peak transconductance of 220 mS mm−1and a current density greater than 800 mA mm−1. Similarly, the device had a transconductance of more than 80 percent of the peak value over a wide drain current range of 160 to 800 mA mm−1. The improvement of device linearity and the enhancement of current density suggest that high-to-low doped-channel devices for both an HFET and a CAMFET are suitable for high-power large signal circuit applications.
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