Thermochemical and physical properties of printed circuit board laminates and other polymers used in the electronics industry |
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| Institution: | 1. Max Planck Institute of Immunobiology and Epigenetics, Stuebeweg 51, 79108 Freiburg, Germany;2. University of Freiburg, Germany;3. International Max Planck Research School of Cellular and Molecular Biology, Freiburg, Germany;4. Ecologie et Evolution des Interactions, Université de Perpignan Via Domitia, UMR 5244, 66860 Perpignan, France;1. Universidad Nacional de San Luis, San Luis, Argentina;2. Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET), Buenos Aires, Argentina;3. Comisión Nacional de Energía Atómica, Buenos Aires, Argentina |
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| Abstract: | Theories behind four thermal analysis techniques are reviewed, and relevant case studies are used to illustrate the application of these techniques to measure; various parameters relevant to printed circuit board laminates and engineering polymers.Thermogravimetric analysis (TGA) is used to determine the filler content of polymers and composites and when combined with Fourier transform infrared (FTIR) spectroscopy can be used for the chemical analysis of evolved gases.Differential scanning calorimetry (DSC) is used to measure the melting point of polymers and the degree of cure of prepregs, laminates and adhesives.Thermomechanical analysis (TMA) is used to measure the coefficient of thermal expansion (CTE) and the glass transition temperature (Tg) of laminates, and dynamic mechanical analysis (DMA) is used to measure the storage modulus, loss; modulus and Tan δ of polymers. |
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| Keywords: | Electronic materials PCB laminates Polymers Thermal analysis |
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