On some consequences of an external magnetic field applied to HTS coils

A computational model which enables to evaluate the distribution of the critical currents, electric fields and the voltage in the winding of a solenoidal high temperature superconducting (HTS) magnets subjected to an external magnetic field parallel with the magnet axis, was developed. The model comes out from the well-known power law between the electric field and the transport current of the HTS tape short sample. It allows to predict the voltage–current V(I) characteristics of both the pancake coils and the complete magnet. The model was applied to the magnet system consisting of 22 pancake coils made of multifilamentary Bi(2223)/Ag tape at 20 K, which is subjected to an external uniform magnetic field parallel with the coil axis. A rather unexpected behavior of the magnet at different operating conditions (operating current and external magnetic field strength) is predicted, analyzed and reported together with a theoretical explanation. On one hand, the external uniform magnetic field parallel with the coil axis increases the resulting magnetic field strength, however, on the other hand it simultaneously decreases the angle between the resulting magnetic field and the tape surface. Thus, the effect of higher magnetic loading caused by the presence of an external magnetic field strength which is acting on individual turns located close to the coil’s flanges is compensated by more favorable orientation of the tape with respect to the resulting magnetic field. As a result, increase in the critical currents of these turns is expected. Further, the results indicate, that in case of the high field HTS insert coils the anisotropy in the I_c(B) characteristic does not play a substantial role. As a consequence, the technology of the production of the tapes for high field insert HTS coils should concentrate rather on the tapes having the current carrying capacity as high as possible, than on the attempt how to decrease the anisotropy in the I_c(B) by changing the architecture of the filaments in the tape.