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A mode III crack in functionally graded piezoelectric materials
Authors:B L Wang
Institution:Department of Manufacturing Engineering and Engineering Management (MEEM), City University of Hong Kong, Kowloon Tong, Hong Kong, PR China;Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, PR China
Abstract:This paper considers the mode III crack problem in functionally graded piezoelectric materials. The mechanical and the electrical properties of the medium are considered for a class of functional forms for which the equilibrium equations have an analytical solution. The problem is solved by means of singular integral equation technique. Both a single crack and a series of collinear cracks are investigated. The results are plotted to show the effect of the material inhomogeneity on the stress and the electric displacement intensity factors.
Keywords:Functionally graded materials  Piezoelectric materials  Smart materials  Fracture mechanics
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