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Investigation of etch characteristics of non-polar GaN by wet chemical etching
Authors:Hsiao-Chiu Hsu  Shin-Hao Cheng  Jia-Ming Cao
Institution:a Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan
b Department of Electrical Engineering, Kun Shan University of Technology, Yung-Kang, Tainan 710, Taiwan
c Department of Electro-optical Engineering, Kun Shan University of Technology, Yung-Kang, Tainan 710, Taiwan
Abstract:We characterized the surface defects in a-plane GaN, grown onto r-plane sapphire using a defect-selective etching (DSE) method. The surface morphology of etching pits in a-plane GaN was investigated by using different combination ratios of H3PO4 and H2SO4 etching media. Different local etching rates between smooth and defect-related surfaces caused variation of the etch pits made by a 1:3 ratio of H3PO4/H2SO4 etching solution. Analysis results of surface morphology and composition after etching by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) demonstrated that wet chemical etching conditions could show the differences in surface morphology and chemical bonding on the a-plane GaN surface. The etch pits density (EPD) was determined as 3.1 × 108 cm−2 by atom force microscopy (AFM).
Keywords:Gallium nitride  Non-polar  Wet chemical etching  X-ray photoelectron spectroscopy
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