Oligomeric bisphenol A‐based PEEK‐like phthalonitrile‐cure and polymer properties

The cure behavior and properties of oligomeric bisphenol A‐based PEEK‐like phthalonitrile (PN) are thoroughly examined in this article. The resin is easily processed from the melt at a relatively low temperature (150–200 °C) and the monomer cure occurs in a controlled manner as a function of the amine content and processing thermal conditions. Dynamic mechanical measurements and thermogravimetric analysis show that the polymer properties improve as the maximum PN postcure temperature is increased to 415 °C. The effects of the amine and polymer postcure conditions on the flexural and tensile properties of the PN polymer are investigated. The mechanical properties of the polymer are maximized after postcuring to moderate temperatures (330–350 °C). The polymer exhibits an average flexural strength and tensile strength at break of 117 and 71 MPa, respectively. After oxidative aging at 302 °C for 100 h, the polymer retains excellent mechanical properties. The average flexural and tensile strength retention of the polymers are 81 and 75%, respectively. Microscale calorimetric measurements reveal that the flammability parameters of the oligomeric PN are low compared to other thermosets. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3769–3777