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| 高速雪崩光探测器同轴封装的高频分析 | |
| 引用本文： | 徐光辉,柴广跃,彭金花,黄长统,段子刚,谭科民.高速雪崩光探测器同轴封装的高频分析[J].光子学报,2012,41(2):240-243. |
| 作者姓名： | 徐光辉 柴广跃 彭金花 黄长统 段子刚 谭科民 |
| 作者单位： | 1. 深圳大学 光电子学研究所 光电子器件与系统教育部重点实验室,广东 深圳 518060; 2. 安徽建筑工业学院 电子与信息工程学院,合肥 230601; 3. 中国电子科技集团第十三研究所,石家庄 050051 |
| 基金项目： | 高等学校优秀青年人才基金项目(No.2009SQRZ099)和国家高技术研究发展计划项目(No.2007AAJ218)资助 |
| 摘 要： | 基于频率响应理论模型,分析了同轴封装的雪崩光电探测器的高频特性.包含芯片、键合金丝、跨阻放大器和同轴管座等各部分的高频特性及对器件高频特性的影响.通过调节封装过程中不同键合金丝引入的电感参量,可以得到不同现象的频率响应.最后考虑实际工程条件,优化得到了10 GHz的-3 dB带宽的同轴封装雪崩光电探测器件. |
| 关 键 词： | 雪崩光电探测器 同轴封装 频率响应 跨阻放大器 |
| 收稿时间： | 2011-09-16 |
| 修稿时间： | 2011-11-05 |
High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors |
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| XU Guang-hui,CHAI Guang-yue,PENG Jin-hua,HUANG Chang-tong,DUAN Zi-gang,TAN Ke-min.High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors[J].Acta Photonica Sinica,2012,41(2):240-243. | |
| Authors: | XU Guang-hui CHAI Guang-yue PENG Jin-hua HUANG Chang-tong DUAN Zi-gang TAN Ke-min |
| Institution: | 1. Institute of Optoelectronics,Shenzhen University,Shenzhen, Guangdong 518060,China; 2. School of Electronic &|Information Engineering,Anhui University of Architecture,Hefei 230601,China; 3. Institute of Hebei Semiconductor,Shijiazhuang 050051,China |
| Abstract: | Based on the frequency response model,high frequency characteristic analysis for the TO packaged avalanche photodetectors is presented.The influence on frequency performance of TO packaging,including chip,bondwire,transimpedance amplifer,and TO header elements are investigated.By changing inductance parameters induced by different bandwires,the different frequency responses are observed.Finally,by considering the engineering conditions,a -3 dB bandwidth of 10GHz is optimally obtained for TO packaging. |
| Keywords: | Avalanche photodetector TO can packaging Frequency response Transimpedance amplifer |
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