首页 | 本学科首页   官方微博 | 高级检索  
     检索      

非水溶剂快速挥发法合成大孔径高有序度介孔有机氧化硅材料
引用本文:张震东,严晓霞,田博之,沈绍典,陈德宏,方千荣,朱广山,裘式纶,赵东元.非水溶剂快速挥发法合成大孔径高有序度介孔有机氧化硅材料[J].高等学校化学学报,2005,26(4):603-606.
作者姓名:张震东  严晓霞  田博之  沈绍典  陈德宏  方千荣  朱广山  裘式纶  赵东元
作者单位:1. 复旦大学化学系, 创新材料与分子催化实验室, 上海 200433; 2. 吉林大学化学学院, 无机合成与制备国家重点实验室, 长春 130023
基金项目:中国科学院资助项目;国家自然科学基金
摘    要:利用非水溶剂快速挥发的方法,以三嵌段共聚物P123等作为结构导向剂,双三乙氧硅基乙烷作为硅源,合成出一系列大孔径(>4nm)、高有序度、具有二维六角结构并且墙壁中含双亚甲基的介孔有机氧化硅(PMO)材料,并通过XRD、TEM、N2吸附-脱附、29SiNMR和SEM等方法对材料进行了表征.

关 键 词:介孔有机氧化硅材料  合成  非水溶剂快速挥发  
文章编号:0251-0790(2005)04-0603-04
收稿时间:2004-08-27

Synthesis of Highly Ordered Large-pore Mesoporous Organosilicas by Non-aqueous Solvent Evaporation Method
ZHANG Zhen-Dong,YAN Xiao-Xia,TIAN Bo-Zhi,SHEN Shao-Dian,CHEN De-Hong,Fang Qian-Rong,ZHU Guang-Shan,QIU Shi-Lun,ZHAO Dong-Yuan.Synthesis of Highly Ordered Large-pore Mesoporous Organosilicas by Non-aqueous Solvent Evaporation Method[J].Chemical Research In Chinese Universities,2005,26(4):603-606.
Authors:ZHANG Zhen-Dong  YAN Xiao-Xia  TIAN Bo-Zhi  SHEN Shao-Dian  CHEN De-Hong  Fang Qian-Rong  ZHU Guang-Shan  QIU Shi-Lun  ZHAO Dong-Yuan
Institution:1. Molecular Catalysis & Innovate Materials Lab, Department of Chemistry, Fudan University, Shanghai 200433, China; 2. State Key Laboratory of Inorganic Synthesis and Preparative Chemistry, College of Chemistry, Jilin University, Changchun 130023, China
Abstract:Highly ordered hexagonal mesoporous organosilicas with large pore size(>4 nm) were synthesized by non-aqueous solvent evaporation method using triblock copolymers as the structure-directing agents and 1,2-bis(triethoxysilyl)ethane as the organically bridged silica source. The mesoprous organosilicas were characterized by small-angle powder X ray diffraction(XRD), transmission electron microscopy(TEM), nitrogen adsorption, ~ ~29 Si MAS NMR spectroscopy and scanning electron microscope(SEM).
Keywords:Mesoporous organosilica material  Synthesis  Non-aqueous solvent evaporation
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《高等学校化学学报》浏览原始摘要信息
点击此处可从《高等学校化学学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号