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Quantitative depth profiling of photoacid generators in photoresist materials by near-edge X-ray absorption fine structure spectroscopy
Authors:Vivek M. Prabhu  Sharadha Sambasivan  Linda K. Sundberg
Affiliation:a Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States
b Ceramics Division, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States
c IBM Almaden Research Center, 650 Harry Road, San Jose, CA 951205, United States
Abstract:
Near-edge X-ray absorption fine structure (NEXAFS) spectroscopy was used to quantify the surface composition and depth profiling of photoacid generators in thin film photoresist materials by varying the entrance-grid bias of a partial electron yield detector. By considering model compositional profiles, NEXAFS distinguishes the surface molar excess within the top 6 nm from the bulk. A surface enriched system, triphenylsulfonium perfluorooctanesulfonate, is contrasted with a perfluorobutanesulfonate photoacid generator, which displays an appreciable surface profile within a 6 nm segregation length scale. These results, while applied to 193-nm photoresist materials, highlight a general approach to quantify NEXAFS partial electron yield data.
Keywords:Immerison lithography   Lithography   Photoresist   Segregation   Near edge X-ray absorption fine spectroscopy   NEXAFS   Thin film
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