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Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack*
作者姓名:张雪锋  徐静平  黎沛涛  李春霞  官建国
作者单位:Department of Electronic Science & Technology, Huazhong University of Science and Technology, Wuhan, 430074, China;Department of Electronic Science & Technology, Huazhong University of Science and Technology, Wuhan, 430074, China;Department of Electrical & Electronic Engineering, the University of Hong Kong, Pokfulam Road, Hong Kong, China;Department of Electrical & Electronic Engineering, the University of Hong Kong, Pokfulam Road, Hong Kong, China;State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China
基金项目:Project supported by the National Natural Science Foundation of China (Grant No~60776016), the RGC of HKSAR, China (Grant No~HKU7142/05E), and Open Foundation of State Key Laboratory of Advanced Technology for Materials Synthesis and Processing (Grant No~
摘    要:A physical model for mobility degradation by interface-roughness scattering and Coulomb scattering is proposed for SiGe p-MOSFET with a high-k dielectric/SiO2 gate stack. Impacts of the two kinds of scatterings on mobility degradation are investigated. Effects of interlayer (SiO2) thickness and permittivities of the high-k dielectric and interlayer on carrier mobility are also discussed. It is shown that a smooth interface between high-k dielectric and interlayer, as well as moderate permittivities of high-k dielectrics, is highly desired to improve carriers mobility while keeping alow equivalent oxide thickness. Simulated results agree reasonably with experimental data.

关 键 词:电介质 散射理论 退化 物理特征
文章编号:1009-1963/2007/16(12)/3820-07
收稿时间:2007-04-19
修稿时间:2007-05-14
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