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Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack*
引用本文:张雪锋,徐静平,黎沛涛,李春霞,官建国. Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack*[J]. 中国物理, 2007, 16(12): 3820-3826
作者姓名:张雪锋  徐静平  黎沛涛  李春霞  官建国
作者单位:Department of Electronic Science & Technology, Huazhong Universityof Science and Technology, Wuhan, 430074, China;Department of Electronic Science & Technology, Huazhong Universityof Science and Technology, Wuhan, 430074, China;Department of Electrical & Electronic Engineering, the Universityof Hong Kong, Pokfulam Road, Hong Kong, China;Department of Electrical & Electronic Engineering, the Universityof Hong Kong, Pokfulam Road, Hong Kong, China;State Key Laboratory of Advanced Technology for Materials Synthesisand Processing, Wuhan University of Technology, Wuhan 430070, China
基金项目:Project supported by the National Natural ScienceFoundation of China (Grant No~60776016), the RGC of HKSAR, China (GrantNo~HKU7142/05E), and Open Foundation of State Key Laboratory of AdvancedTechnology for Materials Synthesis and Processing (Grant No~
摘    要:A physical model for mobility degradation by interface-roughness scattering and Coulomb scattering is proposed for SiGe p-MOSFET with a high-k dielectric/SiO2 gate stack. Impacts of the two kinds of scatterings on mobility degradation are investigated. Effects of interlayer (SiO2) thickness and permittivities of the high-k dielectric and interlayer on carrier mobility are also discussed. It is shown that a smooth interface between high-k dielectric and interlayer, as well as moderate permittivities of high-k dielectrics, is highly desired to improve carriers mobility while keeping alow equivalent oxide thickness. Simulated results agree reasonably with experimental data.

关 键 词:电介质 散射理论 退化 物理特征
文章编号:1009-1963/2007/16(12)/3820-07
收稿时间:2007-04-19
修稿时间:2007-05-14

Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack
Zhang Xue-Feng,Xu Jing-Ping,Lai Pui-To,Li Chun-Xia and Guan Jian-Guo. Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack[J]. Chinese Physics, 2007, 16(12): 3820-3826
Authors:Zhang Xue-Feng  Xu Jing-Ping  Lai Pui-To  Li Chun-Xia  Guan Jian-Guo
Affiliation:Department of Electrical & Electronic Engineering, the Universityof Hong Kong, Pokfulam Road, Hong Kong, China; Department of Electronic Science & Technology, Huazhong Universityof Science and Technology, Wuhan, 430074, China; State Key Laboratory of Advanced Technology for Materials Synthesisand Processing, Wuhan University of Technology, Wuhan 430070, China
Abstract:A physical model for mobility degradation by interface-roughness scatteringand Coulomb scattering is proposed for SiGe p-MOSFET with a high-$k$dielectric/SiO$_{2}$ gate stack. Impacts of the two kinds of scatterings onmobility degradation are investigated. Effects of interlayer (SiO$_{2})$thickness and permittivities of the high-$k$ dielectric and interlayer oncarrier mobility are also discussed. It is shown that a smooth interfacebetween high-$k$ dielectric and interlayer, as well as moderate permittivitiesof high-$k$ dielectrics, is highly desired to improve carriers mobility whilekeeping a low equivalent oxide thickness. Simulated results agree reasonablywith experimental data.
Keywords:MOSFET   high-$k$ dielectric   SiGe   interface roughness scattering   Coulombscattering
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