Towards advanced circuit board materials: adhesion of copper foil to ultra‐high molecular weight polyethylene composite

Polyethylene based composites are attractive materials for advanced circuit board applications because of their unique combination of properties: low dielectric constant and loss factor, light weight, high flexural modulus and low thermal expansion coefficient controlled in all spatial directions. This investigation describes a process to consolidate chopped fibers of ultra‐high molecular weight polyethylene concurrently with its bonding to a copper foil. Bonding is affected by a thin sheet of low‐density polyethylene, incorporating a crosslinking agent with a concentration gradient across the sheets thickness. In this single step process, the composite material is formed and bonded to the metal foil, achieving good adhesion without the use of extraneous glue. Copyright © 2002 John Wiley & Sons, Ltd.