Rapid thermal annealing induced changes on the contact of Ni/Au to N-doped ZnO |
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Authors: | Z.P. Shan S.M. Zhu W. Liu K. Tang H. Chen J.G. Liu Y.D. Zheng |
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Affiliation: | Key Laboratory of Advanced Photonic and Electronic Materials and, Department of Physics, Nanjing University, Nanjing 210093, China |
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Abstract: | N-doped p-type ZnO (p ∼ 1018cm-3) was grown on sapphire(0 0 0 1) substrate by metal-organic chemical vapor deposition method. Ni/Au metal was evaporated on the ZnO film to form contacts. As-deposited contacts were rectifying while ohmic behavior was achieved after thermally annealing the contacts in nitrogen environment. Specific contact resistance was determined by circular transmission line method and a minimum specific contact resistance of 8 × 10−4 Ω cm2 was obtained for the sample annealed at 650 °C for 30 s. However, Hall effect measurements indicate that, as the rapid thermal annealing temperature increased up to 550 °C or higher the samples’ conductive type have changed from p-type to n-type, which may be due to the instability nature of the present-day p-type N-doped ZnO or the dissociation of ZnO caused by annealing process in N2 ambient. Evolution of the sample's electric characteristics and the increment of metal/semiconductor interface states induced by rapid thermal annealing process are supposed to be responsible for the improvement of electrical properties of Au/Ni/ZnO. |
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Keywords: | 71.55.Gs 73.61.Ga 73.40.Ns |
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